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No Clean Solder Paste

Products / 電子材料

用LINE傳送


Flux Type Flux Type Flux Application Method Description Target Application Cleaning Method Halogen Contain Material
Solder paste NC Jetting Jet onto substrate for flip-chip attach SiP Lead Free Metal Alloy,
Type 4/5/6
Solvent or aqueous based chemistry Zero 618J
Solder paste NC Dipping Solder paste applied to the solder bumps on a flip-chip by dipping SiP Lead Free Metal Alloy,
Type 5/6
Solvent or aqueous based chemistry Zero 618D
Solder paste NC Printing Solder paste applied to the substrate by printing SiP Lead Free Metal Alloy,
Type 3/4/5/6
Solvent or aqueous based chemistry Zero 888
825HF
825LS


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