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Wafer plating liquid flux

產品介紹 / 電子材料

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Flux Type Flux Type Flux Application Method Description Target Application Cleaning Method Halogen Contain Material
Wafer Bumping Flux NC Spin coating Liquid flux for reflow of solder bumps on UBM High Pb; Eutectic (63Sn/37Pb); SnAg Solvent or aqueous based chemistry Zero WF-335C
Wafer Bumping Flux WS Spin coating Liquid flux for reflow of solder bumps on UBM SnAg /SnAgCu solder bumps Cleanable with warm DI water only Zero WF-710
WF-711

關鍵字:電子材料生產

電子材料生產|Wafer plating liquid flux


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