Water Soluble Solder Paste

Products / 電子材料

Flux Type	Flux Type	Flux Application Method	Description	Target Application	Cleaning Method	Halogen Contain	Material
Solder paste	WS	Jetting	Jet onto substrate for flip-chip attach	SiP Lead Free Metal Alloy, Type 4/5/6	Cleanable with warm DI water only	Zero	717J
Solder paste	WS	Dipping	Solder paste applied to the solder bumps on a flip-chip by dipping	SiP Lead Free Metal Alloy, Type 5/6	Cleanable with warm DI water only	Zero	718D
Solder paste	WS	Printing	Solder paste applied to the substrate by printing	SiP Lead Free Metal Alloy, Type 3/4/5/6	Cleanable with warm DI water only	Zero HF	798LF 787LV 711LS