No Clean Solder Paste
產品介紹 / 電子材料
| Flux Type | Flux Type | Flux Application Method | Description | Target Application | Cleaning Method | Halogen Contain | Material |
| Solder paste | NC | Jetting | Jet onto substrate for flip-chip attach | SiP Lead Free Metal Alloy, Type 4/5/6 |
Solvent or aqueous based chemistry | Zero | 618J |
| Solder paste | NC | Dipping | Solder paste applied to the solder bumps on a flip-chip by dipping | SiP Lead Free Metal Alloy, Type 5/6 |
Solvent or aqueous based chemistry | Zero | 618D |
| Solder paste | NC | Printing | Solder paste applied to the substrate by printing | SiP Lead Free Metal Alloy, Type 3/4/5/6 |
Solvent or aqueous based chemistry | Zero | 888 825HF 825LS |