台銨科技股份有限公司的產品介紹 Banner圖片

Water Soluble Solder Paste

產品介紹 / 電子材料

用LINE傳送


Flux Type Flux Type Flux Application Method Description Target Application Cleaning Method Halogen Contain Material
Solder paste WS Jetting Jet onto substrate for flip-chip attach SiP Lead Free Metal Alloy,
Type 4/5/6
Cleanable with warm DI water only Zero 717J
Solder paste WS Dipping Solder paste applied to the solder bumps on a flip-chip by dipping SiP Lead Free Metal Alloy,
Type 5/6
Cleanable with warm DI water only Zero 718D
Solder paste WS Printing Solder paste applied to the substrate by printing SiP Lead Free Metal Alloy,
Type 3/4/5/6
Cleanable with warm DI water only Zero
HF
798LF
787LV
711LS


您有任何想詢問的問題嗎?